MiniTest 730 with with external - on lead F 1.5 sensor

With SIDSP® technology, the entire processing takes place in the sensor head where the excitation signals are directly digitally converted and processed at 32 bits accuracy and only the complete and processed digital coating thickness value is communicate to the host gauge. This technique utilizes highly sophisticated methods of digital signal processing such as digital filters, base band converting, averaging, stochastic analysis, etc. utilized by telecommunications technologies.